Bültmann & Gerriets
On-Chip Communication Architectures
System on Chip Interconnect Volume -
von Sudeep Pasricha, Nikil Dutt
Verlag: Elsevier Science
Reihe: Systems on Silicon
Gebundene Ausgabe
ISBN: 978-0-12-373892-9
Erschienen am 29.04.2008
Sprache: Englisch
Format: 242 mm [H] x 197 mm [B] x 34 mm [T]
Gewicht: 1089 Gramm
Umfang: 544 Seiten

Preis: 84,50 €
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Klappentext
Inhaltsverzeichnis

"Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design.
This book is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. "



An Overview of System-on-Chips; Need for Communication-centric Design Flow; Basic Concepts of Bus-based Communication Architectures; Bus-based Communication Architecture Specification Standards; Limitations of Current Design Approaches; Physical and Electrical Analysis; Models for Performance Exploration; Power/Energy Exploration; Design and Synthesis of Communication Architectures; Innovative Aspects; Dynamic Bus Reconfiguration; Bus Encoding Techniques; Interface Synthesis and Optimization; Secure On-chip Communication Infrastructure; Verification; Custom Bus Design; Open Problems; Network-on-Chips; Optical Interconnects; Wireless Interconnects; Physical Design Trends


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