Bültmann & Gerriets
Structural Analysis in Microelectronic and Fiber-Optic Systems
Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
von Ephraim Suhir
Verlag: Springer Netherlands
Hardcover
ISBN: 9789401165372
Auflage: Softcover reprint of the original 1st ed. 1991
Erschienen am 17.02.2012
Sprache: Englisch
Format: 229 mm [H] x 152 mm [B] x 24 mm [T]
Gewicht: 628 Gramm
Umfang: 436 Seiten

Preis: 53,49 €
keine Versandkosten (Inland)


Dieser Titel wird erst bei Bestellung gedruckt. Eintreffen bei uns daher ca. am 7. November.

Der Versand innerhalb der Stadt erfolgt in Regel am gleichen Tag.
Der Versand nach außerhalb dauert mit Post/DHL meistens 1-2 Tage.

53,49 €
merken
zum E-Book (PDF) 53,49 €
klimaneutral
Der Verlag produziert nach eigener Angabe noch nicht klimaneutral bzw. kompensiert die CO2-Emissionen aus der Produktion nicht. Daher übernehmen wir diese Kompensation durch finanzielle Förderung entsprechender Projekte. Mehr Details finden Sie in unserer Klimabilanz.
Klappentext
Inhaltsverzeichnis

This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc­ tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc­ tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi­ ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.



1.1 Research Models in Mechanical Problems for Microelectronics and Fiber Optics.- 1.2 Theoretical Modeling.- 1.3 Analytical versus Numerical Modeling.- 1.4 Interaction with Experiment.- 1.5 Theoretical Modeling in Structural Analysis.- 1.6 Historical Sketch.- 1. Basic Principles of Engineering Elasticity.- 1. General Properties of Elastic Bodies.- 2. Equations and Conceptions.- 3. A View of Solution Procedures.- 4. The Elementary Problems.- 5. Strength Theories.- 6. Two-Dimensional Problem in Rectangular Coordinates.- 7. Two-Dimensional Problem in Polar Coordinates.- 8. Torsion.- 9. Fracture Mechanics.- 10. Plasticity.- 11. Viscoelasticity.- Questions and Problems.- 2. Fundamentals of Structural Analysis.- 12. Bending of Beams.- 13. The Variational and Energy Methods, and Some General Principles of Structural Analysis.- 14. Bending of Frames.- 15. Bending of Plates.- 16. Buckling.- 17. Numerical Methods.- 18. Experimental Techniques.- Questions and Problems.- Appendix: Tables of Beam Deflections.


andere Formate